Hitachi has introduced a high performance TripleBeam™ FIB-SEM—called NX5000—that enables optimal TEM lamella preparation and offers accurate cross-sectioning and 3D-volume microscopy.
With the integrated Ar+/Xe+ beam, users can effortlessly prepare uniform, low damage, ultra-thin TEM lamellae even on the most complex materials.
Gentle, high-precision lamellae finishing
- Ga+-induced damage is prevented
- Thinner, flatter, wider and lower damage lamellae can be made with the built-in Ar+/Xe+ broad beam
- Multi-directional milling avoids curtaining problems
Image Credit: Hitachi High-Tech Europe
High-performance imaging
- The multi-mode STEM and the sensitive in-lens detectors allow users to achieve their required contrast at any time
- Fine structures can be distinctly visualized with the high performance, dual-mode SEM (field-free or immersion)
- Provides sub-nanometer resolution even at low kV
High-performance Ga+ milling
- Rapid FIB/SEM switching (Timesharing mode) provides real-time fabrication and observation with complete clarity
- High throughput with more than 100 nA beam currents
Unique sample-handling solutions
- Samples up to 150-mm diameters can be rapidly exchanged via the load lock
- With the built-in side entry rod holder, lamellae can be directly transferred to the TEM under vacuum
- Double-tilt sub-stage provides more degrees of freedom for exceptional milling geometry
Advanced automation
- The simple recipe creator automates lamella preparation, imaging, cross-section generation and much more
- Complex specimens can be quickly navigated with the CAD navigation system
- Up to 20 TEM lamellae can be automatically lifted out